Photolithography Module
AB-M Aligner #1 (UV)/ (DUV) and #2 (UV)
Light-source illumination: DUV/UV wavelength selectable (500 W Mercury DUV lamp)
Alignment printing mode: Manual
Soft contact: Contact vacuum adjustable
Hard contact: Full vacuum contact
Photomasks: 5" square or 7" square
Substrate sizes: > 5 mm2 to 4" square, or 6"
Special feature: Backside alignment using infrared
No. of machines installed: 2
ASML Stepper (ASML PAS5000/55 Stepper)
Light-source illumination: i-line (365 nm)
Resolution: 0.5 µm
Overlay alignment accuracy: ± 0.1µm (3 σ)
Wafer sizes: 4" or 6"
Field sizes: 15 mm × 15 mm or 10 mm × 10 mm (on wafer)
Reduction ratio: 5:1
Photomask size: 5" square
Karl Suss Bonder SB6
Anodic bonding and silicon fusion pre-bonding
Wafer size: 4”
Substrate materials: Silicon or Pyrex Glass
Pressure: 5×10-5 mbar to 2 bars
Karl Suss MA6 #1 and #2
Light-source illumination: i-line (365 nm)
Resolution: 1 µm
Substrate sizes: > 5 mm2 to 2" or 4"
Photomask size: 5” square
Exposure modes: Contact (soft, hard, low vacuum and Vacuum)
Proximity (exposure gap 1-300 µm); Flood Exposures
Alignment methods: Top-Side Alignment (TSA); Bottom-Side Alignment (BSA)
Alignment accuracy: TSA (down to 0.5 µm); BSA (down to 1 µm)
No. of machines installed: 2
Nanoscribe 3-D Printer
Resolution (depends on the objective lens and the resist):
- 3-D lateral feature size: ≤ 200 nm
- 2-D lateral resolution: ≤ 500 nm;
- Vertical resolution: ≤ 1,500 nm
Speed:
- Beam-scanning speed: 10 mm/s
- Piezo-scanning speed: 100 µm/s
Range:
- Motorized xy-scanning stage range: 100 × 100 mm²
- x-y-z piezo range: 300 x 300 x 300 µm³
- x-y galvo-scan range: 200 - 600 µm Ø depends on scanning objective
Height:
- Object height fine: ≤ 300 µm
- Object height coarse: 3 mm
Objective:
- Immersion Objective: 63×, NA = 1.4; WD = 190 µm
- Immersion Objective: 25×; NA = 0.8; WD = 380 µm
- Air Objective: 20×, NA = 0.5; WD = 2.1 mm
Sample holders:
| Model | Substrate Type | Substrate Dimensions | Substrate Thickness |
| DiLL | DiLL substrate | 25 mm × 25 mm | 0.7 mm |
| Microscope slide | 24 – 26 mm × 50 – 76 mm | 1.0 mm | |
| Cover slip | Ø 30 mm | 0.17 mm | |
| Cover slip | Ø 25.4 mm | 0.3 mm | |
| 2" wafer | wafer | Ø 2" | 0.35 - 0.55 mm |
| 4" wafer | wafer | Ø 4" | 0.35 - 0.55 mm |
| 10 × Ø 30 mm | Cover slip | Ø 30 mm / 22 mm × 22 mm | 0.17 mm |
Printing configuration:
| Configuration | Objective | Immersion medium | Substrate(s) | Resist |
| Oil immersion | 63× NA 1.4 | oil | glass 170 µm | IP-L 780 |
| Air | 20× NA 0.5 | air | Silicon, glass | AZ resist, SU8 |
| DiLL | 25× NA 0.8 | ITO-coated glass, Silicon | IP-S | |
| 63× NA 1.4 | fused silica | IP-DIP |
CEE Coater
Spin-speed range: 0- 6,000 rpm
Spin-speed acceleration: 0-30,000 rpm/s
Substrate sizes: 4" or 6"
Others: Frontside-edge bead remover
Desktop Coater
Spin-speed range: 0 to 5,000 rpm
Substrate sizes: > 5 mm2 to 4" square
EVG Spray Coater
Speed range: up to 10,000 rpm
Ramp-up speed: 0-40,000 rpm/s
Heat-chuck temperature: up to 70 ± 1 oC
Spray speed integrate with heat chuck: < 1,500 rpm
Spray-coating nozzle: Ultrasonic Atomizer Nozzle
Syringe dispense rate: 0.01 ml/s to 5 ml/s
Substrate sizes: up to 200 mm or 150 mm × 150 mm
Solitec Coater #1
Spin-speed range: 250 – 5000 rpm
Spin-speed acceleration: 1000 – 4000 rpm/sec
Substrate sizes: Larger than 5 mm, 2 to 4", 5" square for single-side coating or 4" for double-side coating
SUSS Coater
Spin-speed range : 0 to 7000 rpm
Spin-speed acceleration: 0 – 5000 rpm/s
Coat system: Open Bowl; GYRSET
Substrate sizes: > 5 mm2 to 6" or 5" square for single-side coating, 4" for double-side coating
Others: Programmable bowl auto-clean; Edge-bead remover
SVG88 Coater Track and SVG88 Developer Track
Automatic tracks for resist coating and developing
No. of tracks: 2
Coat track feature: Vapor prime chill plate; Coat module backside rinse; Frontside edge-bead remover; two hot plate ovens
Develop track: Developer module, chill plate, two hot plate ovens
Coating uniformity: ± 0.3 %
Wafer size: 4" and 6"
Wafer loading/unloading: Cassette-to-cassette
High-Temperature Conventional Oven
High-temperature oven: Up to 450 oC
Conventional oven temperature: Up to 250 oC
Substrate sizes: Up to 6"
Hot Plates
Computer temperature-controller with digital readout
Substrate sizes: up to 6"
Temperature: 50 to 250 oC
Temperature uniformity: ± 1 oC
Vacuum Oven
Temperature: Up to 300 oC
Substrate sizes: 1 cm2 to 4"
Vacuum: 0 to 30 in.Hg
Others: N2 purge
Nikon IC Inspection Microscope with a Digital Camera
Contrast methods: BF /DF/ DIC/ Fluorescence
Magnification: 50× - 1500×
Wafer holder: up to 6"
Mask holder: 5" square
Digital camera: 5M-pixel CCD
Display: 8.4" TFT LCD XGA
Software: Dimension measurement tool