Sections
Left Column
Text Area
The NFF (CWB) Deep-RIE Process Center (Room 2223) houses two DRIE systems for silicon etching and a surface profiler for measurements.
Text Area
Text Area
Equipment List
- STPS Rapier DRIE Etcher
- STS Multiplex ICP DRIE Etcher
- KLA-Tencor P-10 Surface Profiler
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Image
Image
![nffdeeprie process center](/sites/gcnfc2022.prod01.ust.hk/files/2022-04/pic_facilities_nffdeeprie_center_01.jpg)