The NFF (CWB) Deep-RIE Process Center

Sections
Left Column
Text Area

The Deep RIE Process Center (Room 2223) houses two DRIE systems for Silcon etch and a surface profiler for measurement.

Text Area

 

Text Area

Equipment List

  • STPS Rapier DRIE Etcher
  • STS Multiplex ICP DRIE Etcher
  • KLA-Tencor P-10 Surface Profiler

DETAILS

Right Column
Image
Image
nffdeeprie process center