The NFF (CWB) TSV Process Laboratory

The NFF (CWB) TSV Process Laboratory (Room 2227) houses an electroplating equipment for metal deposition and polishers for wafer polishing.

 

Equipment List

  • Buehler Polisher #1
  • Buehler Polisher #2
  • Copper Electroplating
  • Silicon Grinder

DETAILS

nff_electoplating_01
The NFF (CWB) Nanofabrication Demonstration Laboratory
Rm 3114, 3/F (Lift no. 19)
The Hong Kong University of Science and Technology
Clear Water Bay
Kowloon, Hong Kong