Sections
Left Column
Text Area
The NFF (CWB) TSV Process Laboratory (Room 2227) houses an electroplating equipment for metal deposition and polishers for wafer polishing.
Text Area
Text Area
Equipment List
- Buehler Polisher #1
- Buehler Polisher #2
- Copper Electroplating
- Silicon Grinder
Right Column
Image
Image