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Scanning Electron Microscope HITACHI SU8600
| Remark | : The Disco DAD321 is an easy-to-use automatic / semi-automatic dicing saw capable of cutting wafers using a high-output air spindle with a diamond blade attached. |
| Main Dimensions(mm) | : 500 x 1050 x 1455 |
| Substrate Size | : 4" silicon full wafer |
| Wafer Thickness | : 525µm |
| Blue Tape Thickness | : 70µm |
| Blade OD | : 2" |
| Blade Thickness | : 27.5±2.5µm |
| Max Blade Speed | : 30,000rpm |
| Max Feed Speed | : 2mm/s |
| X-axis resolution | : 1µm |
| Y-axis resolution | : 0.2µm |
| Z-axis resolution | : 0.1µm |