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The NFF (CWB) Enterprise Center (Phase III) occupies a floor area of 200 square meters and consists of a plant room and a cleanroom. The plant room is equipped with facilities to support the operation of the cleanroom. The cleanroom provides class 1,000 and class 100 environments and houses metallization and basic photolithography equipment for front-end wafer processing.
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Equipment List
- AW610 RTP
- Oxford RIE Etcher
- IPC 3000 Asher #3
- Cooke Evaporator #2
- AST 600EI Evaporator
- AST 450I Evaporator
- Wet Station M1:MS2001 Resist Strip
- Wet Station M2:Branson 5510 Ultrasonic Cleaner
- Wet Station M3:MS2001 Mask Cleaning
- Wet Station O: HCl Cleaning
- Karl Suss MA6 #1
- JEOL JBX-6300FS E-Beam Lithography System
- Solitec Coater #1
- Oven-D (120 ℃)
- Oven-E (105 ℃)
- EMS Hot Plate #1 (50 ℃)
- CEE Hot Plate #2 (90 ℃)
- Hot Plate (110 ℃)
- HMDS Primer #3
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