The NFF (CWB) TSV Process Laboratory

The NFF (CWB) TSV Process Laboratory (Room 2227) houses an electroplating equipment for metal deposition and polishers for wafer polishing.



Equipment List
  • Buehler Polisher #1
  • Buehler Polisher #2
  • Copper Electroplating
  • Silicon Grinder
NFF Electoplating Lab
The NFF (CWB) TSV Process Laboratory
Rm 2227, 2/F (Lift no. 23)
The Hong Kong University of Science and Technology
Clear Water Bay
Kowloon, Hong Kong